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Learn how mmWave designs at frequencies like 5G FR2 have circuit interconnects which face new challenges.
Learn:
Lesson 1 - Designing for Multi-Technology Assenblies
Introduces the concept of multi-technology assemblies and discusses the challenges involved in designing them. It covers topics such as materials selection, thermal management, and signal integrity.
Lesson 2 - Introduction and Integration Trends
Discusses the trends in wafer-level RF chip-scale packaging (WL-RF CSP). It covers topics such as the increasing use of heterogeneous integration, the development of new materials and processes, and the emergence of new applications.
Lesson 3 - Overview of Wafer Level Packaging Challenges
Explains the challenges involved in wafer-level packaging. It covers topics such as the need for high precision and repeatability, the potential for defects, and the need for a controlled environment.
Lesson 4 - Keysight UXR Channel Module
Design and implementation of the Keysight UXR channel module, a wafer-level RF CSP. It covers topics such as the module's architecture, its materials and processes, and its performance.
Lesson 5 - Integrated Phased Array
Discusses the design and implementation of the GlobalFoundries ADK integrated phased array on package, a wafer-level RF CSP. It covers topics such as the module's architecture, its materials and processes, and its performance.
Lesson 6 - Solving the Challenge: Demo on Keysight Assembly and EM Solution
Demonstrates the use of Keysight's Assembly and EM solution to design and simulate a wafer-level RF CSP. It covers topics such as the use of the solution to model the assembly process, to simulate the electromagnetic behavior of the package, and to analyze the results.
Brochures
PathWave Design Software
Gone are the days of simple design. Every year, designers push new limits: longer battery life, smaller components, higher levels of integration. With complex design comes new challenges. Designers spend hours setting up and running simulations. Mountains of data wait to be measured and analyzed. Engineers need to create workarounds to connect multiple design tools. Meanwhile, wireless standards are evolving quickly. To keep up with the strong demands of modern technology, designers need a new approach.
eBooks
Four Secrets to Mastering Millimeter-Wave Communications Circuit Design
Keysight has seen dramatic changes in mobile network devices and infrastructure design, development, and deployment in the transition from 4G to 5G. One substantial challenge affecting circuit design is frequencies extending into the 70 GHz millimeter-wave (mmWave) band. High millimeter-wave frequencies and the drive towards miniaturization directly impact the design of the circuits and systems.
Technical Overviews
5G Microwave-RF EDA Design Flow
PathWave Advanced Design System (ADS) addresses 3 critical requirements for 5G product development that had not been satisfactorily met by other EDA tools in the market before.
Software
W3608B PathWave ADS Core, EM Design, Layout, RFPro, RF Ckt Sim, Sys-Ckt Verification, Complete VTBs
PathWave ADS and EM design environments with 3D RF layout for multi-technology RF module design and module level DRC/LVS/LVL verification for error-free assembly.
How to Simulate an RF Circuit
Validate design performance by simulating your components' characteristics
Identify RF coupling issues early with EM/Circuit Co-Simulation
Learn how mixed microwave and mmWave designs now integrate MMIC, RFIC, laminate, and antennas together in a compact form factor.
