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Lesson 1 - Designing for Multi-Technology Assemblies

Modern communication systems are becoming increasingly complex, and multiple technologies are often required to achieve the proper tradeoff between performance, reliability, and overall system integrity. Using the right set of technology to achieve the best overall system is challenging to even the most advanced engineering teams. Managing multiple technologies individually is difficult enough but combining these into a single integrated assembly that works the first time is extremely challenging.

The problem is that complex assemblies have non-intuitive parasitics and coupling paths which are difficult to predict. Understanding these at the conceptual phase rather than the prototyping phase ensures higher design accuracy which ultimately helps to deliver reliable systems faster, ideally on the first pass. The traditional alternative approach of finding problems after initial development is no longer suitable for today’s spec-to-complete-system environment – it's all about delivering a superior working solution faster and more predictably.

Who should take Designing Wafer-Level Chip-Scale Packaging?

This course is designed for RF circuit designers who want to learn the techniques to better design multi-technology integrated assemblies.

We'll cover:

  • An example of a tool-based methodology for creating a high-performance system in a package that seamlessly integrates multiple technologies together to achieve functionality that would otherwise not be possible without the insights gained in the initial design cycle.
  • A demonstration in Keysight’s Advanced Design System (ADS) that assembles multiple disparate packaging technologies into a cohesive system quickly and efficiently, to the point where analysis across technology boundaries becomes trivial.

Duration: 50 min